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B0520WS
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
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Low Forward Voltage Drop
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Guard Ring Die Construction for Transient Protection
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High Conductance
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Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
Mechanical Data
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Case: SOD-323
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Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
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Moisture Sensitivity: Level 1 per J-STD-020D
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Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). Solderable per MIL-STD-202, Method 208
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Polarity: Cathode Band
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Marking Information: See Page 2
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Ordering Information: See Page 2
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Weight: 0.004 grams (approximate)
Top View
Maximum Ratings
@TA
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20
V
RMS Reverse Voltage
VR(RMS)
14
V
Average Rectified Output Current
IO
0.5
A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
IFSM
2
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
PD
235
mW
Typical Thermal Resistance Junction to Ambient (Note 1)
RθJA
426
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +125
°C
Electrical Characteristics
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Test Conditions
Minimum Reverse Breakdown Voltage (Note 2)
V(BR)R
20
V
IR
= 0.5mA
Maximum Forward Voltage Drop
VF
0.310
0.430
V
IF
= 0.1A
IF = 0.5A
Maximum Leakage Current (Note 2)
IR
100
250
μA
VR
= 10V
VR
= 20V
Typical Total Capacitance
CT
58
pF
f = 1MHz, VR
= 0VDC
Notes: 1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and
newer are built with Green Molding Compound. Product manufactur
ed prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2O3
Fire Retardants.
B0520WS
Document number: DS30235 Rev. 12 - 2
1 of 3
www.diodes.com
June 2008
? Diodes Incorporated
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